Nvidia has launched NVLink Fusion, a new chip interconnect technology aimed at speeding up communication between processors.
Presented by CEO Jensen Huang during his keynote at Computex 2025 in Taipei, the announcement came with a message that Nvidia no longer intends to be just a chipmaker, it wants to become the backbone of the next wave of AI infrastructure.
NVLink Fusion is offering rival chipmakers a piece of the technology Nvidia itself uses to build its high-performance AI systems.
Marvell Technology and MediaTek have already signed on to adopt NVLink Fusion, showing early industry trust. This technology enables chip-to-chip communication speeds up to 14 times faster than PCIe, a good move forward for training and running AI models at scale.
It’s not limited to Nvidia’s own systems anymore. Companies building their own AI chips can now link multiple processors with Nvidia’s own fabric, essentially bringing them into the Nvidia AI ecosystem.
“Once upon a time, I spent 90 percent of my keynote talking about graphics cards,” Huang said. “Now, our mission is to build the AI infrastructure of the future.”
That infrastructure includes partnerships with Qualcomm, Fujitsu, Alchip, Astera Labs, Synopsys, and Cadence to make NVLink Fusion usable across full rack-scale AI architectures.
Huang also used the stage to reveal Nvidia’s next line of AI chips. The Blackwell Ultra is due out later this year. Rubin will follow, and a new chip family named Feynman is set for 2028.
These timelines are Nvidia’s roadmap for staying ahead in an industry that’s evolving faster than any before it.
The company also confirmed that its desktop AI computer, DGX Spark, designed for researchers, has entered full production and will be available within weeks.
Outside the announcements, Nvidia is strengthening its physical footprint in Asia. Huang revealed plans to build a new regional headquarters in Taipei’s northern suburbs, reflecting both commercial intent and geopolitical awareness as semiconductor influence shifts eastward.
Computex 2025, with over 1,400 exhibitors, marks the return of major chip players to Asia since the U.S. government’s tariff threats reshaped global manufacturing strategies.
